氧化锆陶瓷研磨(mo)、抛(pao)光加工(gong)(gong)是(shi)采用(yong)游离磨(mo)料(liao)对(dui)被加工(gong)(gong)表面材料(liao)产(chan)生微细去除作用(yong)以达到(dao)加工(gong)(gong)效果(guo)的(de)(de)一种超(chao)精加工(gong)(gong)方法。在陶瓷(ci)材料(liao)的(de)(de)超(chao)精加工(gong)(gong)与光整加工(gong)(gong)中(zhong)，特别是(shi)在用(yong)于(yu)陶瓷(ci)轴承(cheng)的(de)(de)陶瓷(ci)球的(de)(de)精密(mi)加工(gong)(gong)中(zhong)，研磨(mo)、抛(pao)光加工(gong)(gong)有着不可替代的(de)(de)位置。

　　光(guang)(guang)学玻(bo)璃(li)、蓝宝石(shi)等光(guang)(guang)学材(cai)(cai)料，硅片、GaAs基片等半导体(ti)材(cai)(cai)料，氧化锆(gao)陶(tao)(tao)瓷、氧化铝陶(tao)(tao)瓷等陶(tao)(tao)瓷材(cai)(cai)料的镜(jing)面加工大多采用研磨、抛光(guang)(guang)加工方法。

　　从材(cai)料(liao)的(de)去(qu)除(chu)机理上看，研磨加(jia)工(gong)是介于氧(yang)化锆陶瓷脆性破坏(huai)与弹(dan)性去(qu)除(chu)之间的(de)一种加(jia)工(gong)方法，而抛光加(jia)工(gong)基本上是在材(cai)料(liao)的(de)弹(dan)性去(qu)除(chu)范围内进行(xing)。

　　研(yan)磨、抛(pao)光加工(gong)(gong)由于(yu)氧化锆陶瓷(ci)(ci)材料去(qu)除(chu)量小，加工(gong)(gong)效(xiao)率低(di)，一般只用于(yu)氧化锆陶瓷(ci)(ci)超精加工(gong)(gong)的最(zui)终工(gong)(gong)序。

　　研磨(mo)、抛光加(jia)工(gong)的(de)(de)氧化锆陶瓷材料(liao)去除(chu)率(lv)与(yu)被加(jia)氧化锆陶瓷工(gong)材料(liao)的(de)(de)韧(ren)性(xing)有较大关系，氧化锆陶瓷韧(ren)性(xing)越(yue)高，氧化锆陶瓷加(jia)工(gong)效率(lv)越(yue)低。